Thermal pad heatsink silicone GEMBIRD TG-P-01, 100x100x1 mm

Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability – will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Specifications
Weight: 1.5 g
Color: grey
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 C-in2 / W Density: > 2.5
Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1
Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 C Operating Temperature: -50 240 C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%